SPDIP .070" Pitch (1,778mm) DIP & SIP Headers

Mill-Max has introduced a family of SPDIP mating pin headers to compliment its line of SPDIP sockets.

SPDIP (Shrink Plastic) packaging reduces device lead spacing between pins down to .070" pitch (1,78mm). This technology is utilized in memory, microcontrollers, video controllers and automotive design applications.

SPDIP and SPSIP headers are valuable for interconnect applications, such as: board stacking, socket testing and elevating circuits off the board surface.

Mill-Max SPDIP (Shrink DIP) headers are precision-machined using brass alloy 360 and are configured with pluggable tails. They easily mate to their corresponding Mill-Max SPDIP sockets found in the

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